The vapor phase ovens were pretty long and heavy though. The soldering of SMT boards was very convenient when using Vapor Phase because of its excellent heat transfer capabilities. The vapor phase soldering process achieves perfect results on a wide range of assemblies, from flexible to multi-layer substrates, reliably without overheating. I have focused in my dissertation on the reflow soldering part of the surface mounting technology using the Vapour Phase Soldering (VPS) and applying a. Vapor Phase soldering was the process of choice in reflow soldering as it provided the easiest way of heat transfer for the newly developed SMD technique. Irrespective of the time the solder material remains in the vapor, its temperature can never exceed the defined maximum vapor temperature.Īs a result, the solder process can be reliably reproduced and offers ideal pre-conditions for a reliable and repeatable process control. As soon as the solder material is immersed into the vapor zone, the vapor condenses on the solder material and transfers its heat. The vapor’s weight is greater than the surrounding air and forms a protective gas atmosphere (0 ppm oxygen) without the need for any additional gases, such as nitrogen. It was the process of choice in the early 1980s. Vapor phase reflow refers to an advanced PCB soldering technology that uses an inert liquid with a high boiling point. ProcessĪs soon as the fluid starts to evaporate, a layer of saturated vapor and condensing fluid covers the soldering area creating an inert (oxygen-free) atmosphere. Vapor phase soldering (VPS), also known as condensation soldering, has gone through changes in popularity. The boiling point is very accurate depending on the application, most fluids have boiling points between 165☌ up to 260☌. Phase soldering was the preferred reflow soldering technology because of its excellent heat transfer capability. This fluid is non-corrosive, electrically non-conductive and does not deteriorate over time. The concept of the CIF vapor phase soldering allows today. Basic configurationĪ chemically inert fluid is used for the heat transfer. Vapor phase reflow oven VS-500-V The design of the machine allows to solder even the most complex cards with a format of max. The main applications relate to lead and lead-free soldering, conductive adhesives and repair. It allows processing of all components without elaborate setup and without temperature profiling.
It is ideally suited for all types of SMT components and base materials. However, for greater process accuracy, higher quality solder joints, consistently repeatable heating, and lower reflow costs, vapor phase soldering (also known as condensation soldering or vapor phase reflow), is the most flexible, simplest and most reliable reflow soldering method. The best soldering method achieving gentle heating and optimum qualityĪll soldering processes have one thing in common: they are able to securely attach components onto specified base material.
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